通过样品横断面金相观察,TG-DTA及X-射线衍射分析,证明单晶硅与银浆、铝浆(银铝浆)在烧结过程中形成合金,消除硅与电极间的肖特基势垒,使电极与硅形成欧姆接触。
The sintering process between monocrystalline silicon and silver paster or aluminium paster or silver-aluminium paster was observed and analyzed by metallography,X-ray diffraction and differential thermal analysis.The results show that alloys have formed between them,the Schottky Barries has eliminated and the Ohmic contact has established between silicon and electrode.
参考文献
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