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研究微量稀土元素对Sn57Bil Ag无铅焊料合金显微组织以及性能的影响.结果表明,当稀土含量为0.05% ~0.5%(质量分数)时,对该无铅焊料合金的导电性和腐蚀性影响不大,但使熔化区间温度降低;可以提高焊料合金的力学性能,提高焊料的铺展面积,细化组织.比较Ce、Er、Y三种稀土元素对焊料合金的影响,发现Er元素可以更好地提高焊料合金的综合性能,Ce次之.

参考文献

[1] 娄浩焕,朱笑郓,瞿欣,王家楫,Taekoo Lee,Hui WANG.无铅BGA封装可靠性的力学试验与分析[J].半导体技术,2005(03):36-40.
[2] J. Glazer .Metallurgy of low temperature Pb-free solders for electronic assembly[J].International Materials Reviews,1995(2):65-93.
[3] Abtew M;Selvaduray G .Lead-free solders in microelectronics[J].Materials Science and Engineering,2000,27:95-99.
[4] 营沼克昭;宁晓山.无铅焊接技术[M].北京:科学出版社,2004:2-9.
[5] 贾淑果,宁向梅,刘平,郑茂盛,周根树.微量Ce对Cu-Ag-Cr合金性能的影响[J].稀土,2009(03):49-52.
[6] 毛向阳,方峰,谈荣生,蒋建清.稀土对铜及铜合金组织和性能影响的研究进展[J].稀土,2008(03):75-80.
[7] Wu C W;Yu D Q;Law M T .The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements[J].Journal of Electronic Materials,2002,31:921-925.
[8] Wu C W;Yu D Q;Law M T .Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys[J].Journal of Electronic Materials,2002,31:928-934.
[9] Hareesh Mavoori;Ainissa G.Ramirez .Lead-free universal solders for optical and electronic devices[J].Journal of Electronic Materials,2002(11):1160-1165.
[10] D.Q. Yu;J. Zhao;L. Wang .Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):170-175.
[11] 张富文,刘静,杨福宝,胡强,贺会军,徐骏.Sn-Ag-Cu无铅焊料的发展现状与展望[J].稀有金属,2005(05):619-624.
[12] 卢斌;张宇航;章四琪 .微量稀土Ce对SnAgCu系焊料合金性能的影响[J].中国材料科技与设备,2005,4:60-63.
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