在室温下,采用射频磁控溅射法在p 型Si(111)衬底上制备了HfSiON高k栅介质薄膜.用X射线光电子能谱(XPS)分析了HfSiON薄膜的成分,用掠入射X射线衍射(XRD)检测了薄膜的结构,用高分辨率扫描电子显微镜(HRSEM)、原子力显微镜(AFM)观察了薄膜断面和表面形貌.XRD谱显示,HfSiON薄膜经900℃高温退火处理后仍为非晶态.HRSEM断面和AFM形貌像显示所制备的薄膜具有非常平整的表面,表明薄膜具有优良的热稳定性.电学测试表明,HfSiON薄膜具有较好的介电特性,其介电常数较高为18.9,漏电流密度较低在+1.5V为2.5×10-7 A/cm2.这些特性表明HfSiON薄膜是一种很有希望替代SiO2的新型高k栅介质材料,同时也表明射频磁控溅射法是一种制备HfSiON新型高k栅介质薄膜的有效方法.
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