本文比较详细地介绍了苯并环丁烯及其衍生物的合成、反应,并着重阐述了各种苯并环丁烯树脂的自聚、与活性化合物的共聚反应及其所形成的聚合物的结构与性能,同时也简述了亚胺化苯并环丁烯树脂的纤维复合材料的性能.
参考文献
[1] | 丁孟贤;何天白.聚酰亚胺新型材料[M].北京:科学出版社,1998:48. |
[2] | PPenczek;W Kaminska .[J].Advances in Polymer Science,1990,97:41. |
[3] | R A Kirchhoff;K J Bruza.[J].ibid,1994(01):117. |
[4] | 张庆余;韩孝族;纪奎江.低聚物[M].北京:科学出版社,1994 |
[5] | 黄发荣;焦扬声.[J].玻璃钢/复合材料,1991(02):30. |
[6] | DWilson;H.D.Stenzenberger;P.M.Hergenrother .[Z].Polyimides.Blackie:Glasgow,1990. |
[7] | HRaech.Jr.Allylic Resins and Monomers.Reinhold Publishing Co[M].New York,1965 |
[8] | LV McAdams;D A Gannon.[J].Encyclopedia of Polymer Science and Technology,1985(06):332. |
[9] | GOertel.Polyurethane Handbook[M].Hanser Publishers:Munich,1985 |
[10] | LS Tan;E J Soloski;F E Arnold .[J].ACS Symposium Series,1988,367:349. |
[11] | R A Kirchhoff;K J Bruza.[J].Journal of Macromolecular Science:Chemistry,1991(11-12):1079. |
[12] | R.A.Kirchoff .[P].US Patent.US 4,540,763,1985. |
[13] | F E Arnold;L S Tan .[J].International SAMPE Symposium and Exibition,1986,31:968. |
[14] | LK Irwin .[J].Chemical Reviews,1990,70(04):471. |
[15] | S Andera;P Warreu .[J].Journal of Organic Chemistry,1973,38(17):3055. |
[16] | M P Cava;D R Napier .[J].Journal of the American Chemical Society,1957,79:1701. |
[17] | J.A.Oliver;P.A.Ongley .[J].Chemistry and Industry,1965,6:1024. |
[18] | M P Cava;M J Mitchell;A A Deana .[J].Journal of Organic Chemistry,1960,25:1481. |
[19] | Peter Schiess;S Rutschmann;V V Toan .[J].Tetrahedron Letters,1982,23(36):3669-3672. |
[20] | Y-H So .[J].Industrial and Engineering Chemistry Research,1993,32:952-954. |
[21] | R A Kirchhoff;K J Bruza .[J].Adv Polym Sci,1994,117:1. |
[22] | E P Kundig;C Perret;B Rudolph .[J].Helvetica Chimica Acta,1990,73:1970. |
[23] | K A Walker;L J Markoski;J S Moore.[J].Synthesis-Stuttgart,1992:1265. |
[24] | M F Farona .[J].Progress in Polymer Science,1996,21:505. |
[25] | M P Cava;M J Mitchell;A A Deana .[J].Journal of Organic Chemistry,1960,25:1481. |
[26] | K Chino;T Takata;T Endo .[J].Journal of Polymer Science Part A:Polymer Chemistry,1999,37:555-563. |
[27] | LR Denny;I J Goldfarb;M P Farr .[J].ACS Symposium Series,1987,366:367. |
[28] | K A Walker;L J Markoski;G A Deeter et al.[J].Polymer,1994,35(23):5012. |
[29] | T D Dang;C S Wang;W E Click et al.[J].Polymer,1997,38(03):621. |
[30] | K Chino;T Takata;T Endo .[J].Journal of Polymer Science Part A:Polymer Chemistry,1999,37:59-67. |
[31] | E pingel;L J Markoski;G E Spilman et al.[J].POLYMER,1998,40:53. |
[32] | K A Walker;L J Markoski;J S Moore .[J].Macromolecules,1993,26:3713-3716. |
[33] | T D Tang et al.[J].Polym Preprints,1995,36:455. |
[34] | M J Marks;J K Sekinger .[J].Macromolecules,1994,27:4106. |
[35] | M J Marks;J S Erskine;D A McCrery .[J].ibid,1999,27:4114. |
[36] | S L DeLassus;B A Howell;C J Cummings et al.[J].Macromolecules,1994,27:1307. |
[37] | J S Deeken;M F Farona .[J].Journal of Polymer Science Part A:Polymer Chemistry,1993,31:2863. |
[38] | T Endo;T Koizumi et al.[J].Journal of Polymer Science Part A:Polymer Chemistry,1995,33:707. |
[39] | Michael Schier .[J].Journal of the Electrochemical Society,1995,142(09):3238. |
[40] | J. M. Neirynck;R. J. Gutmann;S. P. Murarka .Copper/benzocyclobutene interconnects for sub-100 nm integrated circuit technology: elimination of high-resistivity metallic liners and high-dielectric constant polish stops[J].Journal of the Electrochemical Society,1999(4):1602-1607. |
[41] | 陈祥宝.高性能树脂基体[M].北京:化学工业出版社,1999:227. |
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