通过在不同粒径的二氧化硅微球模板上进行化学镀银得到 SiO2＠Ag 粉体，并进一步在不同尺寸的SiO2＠Ag复合结构上沉积Cu2 O、Cu得核壳结构SiO2＠Ag＠Cu2 O 与SiO2＠Ag＠Cu混合粉末复合颗粒。发现通过改变镀铜液的pH 值与还原剂滴加速率等参数可以控制包覆表层的物相，当pH 值低于10时，不会出现含有铜元素的沉积层；当pH 值处于10~11之间，且降低还原剂滴速有利于得到 Cu2 O 镀层；pH 值提高至12且还原剂滴加速率增高则有利于在表面得到Cu单质包覆层。
In this article,SiO2@Ag@Cu and SiO2@Ag@Cu2 O composite core-shell structure is synthesized by electroless plating a Cu2 O or Cu shell on the powder of SiO2@Ag,where the basic SiO2@Ag is fabricated through the silver plating on different sizes of silica templates.It is found that the changes of parameters like pH value and reducing agent addition rate can regulate and control the outmost shell phase:the Cu2 O shell is appreciable when pH maintains between 10-11 with lower reducing agent addition rate,while higher pH and ad-dition rate of reducing agent will result in a shell mainly composed of Cu.
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