利用粉末覆盖烧结法成功在金刚石表面镀覆W,并采用气体压力熔渗法制备Cu/diamond (W)复合材料.研究了不同镀覆温度对镀层微观结构以及复合材料热导率的影响.结果表明,金刚石表面镀钨有效的改善了界面结合,提高了复合材料热导率.镀层厚度随镀覆温度的提高而明显增加,复合材料热导率先增高再降低.当镀覆工艺为1 050℃保温15 min时,镀层厚度为2 000 nm,复合材料热导率最高可达到670 W/mK.
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