为了改善SiCp 与Al基体之间的界面,在碱性条件下,甲醛作为还原剂,采用化学镀的方法在SiCp 表面沉积铜层,然后采用无压渗透方法制备SiCp/Al复合材料.采用X射线衍射仪、3D立体视频显微镜、扫描电子显微镜来分析化学镀后 SiCp 和复合材料的表面、界面形貌、组织结构及物相,并通过 EDS能谱对复合材料表面元素成分分析,利用激光闪光法测定复合材料导热系数.结果表明,相比酒石酸钾钠单一络合剂,采用酒石酸钾钠和 EDTA-2Na 组成的双络合剂的SiCp 镀层更致密,且镀层未被氧化,复合材料界面结合良好,界面厚度为2．5~3μm,有 AlCu2相生成,无Al4 C3脆性相存在.室温下,镀铜后的复合材料热导率达到181 W/(m·K),远高于没有表面改性的复合材料热导率102 W/(m·K).
In order to improve the interface of between SiC particles and Al matrix,under alkaline condition,the surface of SiC particles was plated with Cu using electroless plating.Then SiCp/Al composites were prepared by pressureless infiltration technology.Surface and interface morphology,microstructure and phase of SiC particle and SiCp/Al composites were analyzed by X-ray diffraction,3D stereo video microscope and scanning electron microscope respectively.The surface element of SiC particles coating and composites was analyzed by EDS, meantime,thermal conductivity of SiCp/Al composites was measured by the laser flash method.The results show that,compared with a single KNaC4H4O6 ·4H2 O complexant,double complexants (KNaC4 H4 O6 · 4H2 O+EDTA-2Na)can more effectively plate a dense,no oxidation and good combined interface Cu coating on the surface of SiCp.The interface thickness of Cu was approximatively 2.5-3μm.AlCu2 phase was detected in the interface,however Al4 C3 brittle phase was not found.The thermal conductivity of SiCp/Al composites was 181 W/(m·K)at 20 ℃.It was much higher than that (102 W/(m·K))of SiCp/Al composites without sur-face modification of SiCp.
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