利用溶胶-凝胶法在(111)Pt/Ti/SiO2/Si 衬底上成功制备了无铅(Na0.85 K0.15)0.5 Bi0.5 TiO3(NK-BT)铁电薄膜。利用XRD 和原子力显微镜(AFM)分别对薄膜的晶化行为和表面形貌进行了表征。结果表明，在一定温度范围内，随着热分解温度和退火温度的升高，薄膜的晶化程度变得越来越完全，晶粒变得更加均匀致密。当热分解温度为450℃、退火温度为700℃时，薄膜表现出最优的晶化行为，其铁电性能良好，剩余极化强度(Pr)和矫顽场强(Ec)分别为10.37μC/cm2和78.2kV/cm。
Lead-free (Na0.85 K0.15 )0.5 Bi0.5 TiO3 (NKBT)ferroelectric thin films were successfully deposited on (111)Pt/Ti/SiO2/Si substrate using a sol-gel route.The crystallization behaviors and the surface morphology of NKBT films were characterized separately by XRD and AFM.It was found that,within a certain tempera-ture range,the crystallinity of films were more and more complete with the increase of pyrolysis temperature and annealing temperature,and the grains became more uniform and dense.The film pyrolyzed at 450℃ and annealed at 700℃ exhibited optimal crystallinity,the good ferroelectric properties with a remanent polarization of 10.37μC/cm2 and a coercive field of 78.2kV/cm for NKBT film were achieved.
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