在Sn-4.1X-1.5Cu-Ni焊料合金中添加0.05％(质量分数,下同)(La+Ce),对焊料/Cu焊点等温时效后其界面组织的变化规律以及界面金属间化合物的形成和生长行为进行分析研究,结果表明:随着等温时效时间的延长,Sn-4.1X-1.5Cu-Ni/Cu和Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/Cu IMC层厚度增加,其界面金属间化合物的增厚主要由扩散机制控制；在SnXCuNi焊料合金中添加0.05％ (La+ Ce)后,能有效抑制等温时效过程中界面IMC的形成和生长,从而提高了焊点的可靠性,其中Sn-4.1X-1.5Cu-Ni/Cu的生长速率为2.95×10-17m2/s,Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/Cu的生长速率为2.51×10-17m2/s.
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