采用炉冷、空冷、水冷和液氮冷却方式以及外加磁场的方法研究不同的凝固方式对Sn-Bi钎料的冲击韧性和显微组织的影响.研究结果表明,快速冷却与旋转磁场均能细化钎料合金的微观组织,抑制粗大树枝晶的生长,但快速冷却会造成Bi的偏析,旋转磁场会造成组织不均.同时快速冷却与旋转磁场都会破坏含Ge合金的塑性改善机制,造成含Ag合金中Ag3Sn相粗大,而旋转磁场的离心力作用还会造成Ag3Sn相和Bi相的宏观偏析.在组织细化以及成分偏析的共同作用下,Sn-57Bi共晶钎料的冲击韧性随冷却速率的增大呈现先增加后减少的趋势.
参考文献
| [1] | K. N. Tu;A. M. Gusak;M. Li .Physics and materials challenges for lead-free solders[J].Journal of Applied Physics,2003(3):1335-1353. |
| [2] | 李元山 .低熔点无铅焊料Sn-B-X的研制与无铅焊接工艺研究[D].长沙:湖南大学,2007. |
| [3] | 徐骏,胡强,林刚,张富文.Sn-Bi系列低温无铅焊料及其发展趋势[J].电子工艺技术,2009(01):1-4. |
| [4] | 鲜飞.无铅焊料的新发展[J].电子与封装,2006(04):6-9. |
| [5] | KIM Y S;KIM K S;HWANG C W .Effects of composition and ccooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys[J].Journal of Alloys and Compounds,2003,352:237-245. |
| [6] | H.Takao;H.Hasegawa .Influence of Alloy Composition on Fillet-Lifting Phenomenon in Tin Binary Alloys[J].Journal of Electronic Materials,2001(5):513-520. |
| [7] | SALAM F A;KHALEK A M A;NAD A R H .Effect of silver addition on the creep parameters of Sn-7wt.%Bi alloy during transformation[J].Materials Characterization,2008,59:9-17. |
| [8] | S. M. L. Nai;J. Wei;M. Gupta .Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1/2):166-169. |
| [9] | ANDRE LEE;K.N.SUBRAMANIAN .Development of Nano-Composite Lead-Free Electronic Solders[J].Journal of Electronic Materials,2005(11):1399-1407. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%