基于Mori-Tanaka理论和Eshelby等效夹杂理论,假定基体和增强相界面结合完好,推导出在力的边界条件下两相复合材料各组成相的应力、应变以及复合材料的体平均应变和应力,并考虑了基体和增强颗粒热膨胀系数引起的热应变以及各相塑性应变的影响.在此基础上,假定基体和复合材料均为各向同性材料,颗粒仅产生弹性变形,基体产生弹塑性变形且满足Mises屈服准则和等向强化准则,由颗粒所受的拉应力控制界面的脱粘,脱粘概率由Weibull分布函数来描述,脱粘后的颗粒等效为孔洞,采用割线模量法讨论了球形颗粒增强金属基复合材料有界面脱粘时的弹塑性性能,理论预测与实验结果吻合较好.
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