研究了测量磁头表面超薄DLC薄膜和Si中间层厚度的方法,所用的设备有:AES,XPS,TEM.研究结果显示,XPS和AES测量的结果较为吻合,TEM的结果则存在较大差异.在TEM高分辩像下无法分清DLC和Si层,并对AES,XPS和TEM结果产生差异的原因进行了分析.
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