用乙二醛取代甲醛作为还原剂在ABS塑料上化学预镀铜,然后在碱式碳酸铜为主盐的碱性镀铜液电镀.研究了电镀液组成、pH对镀层结构的影响.最佳镀铜工艺为27 g/L KNaC4H4O6、25 g/L CuCO3·Cu (OH)2 ·H2O、250 g/L C6H8O7、10 g/L NaHCO3,pH为8.5,Jκ为1.0 A/dm2,t为30min.采用电子扫描电镜观察和X-射线衍射仪分析表征镀层具有单质铜的特征,镀层均匀、致密.结果表明碱性镀液可以有效地保护化学预镀层.
参考文献
| [1] | 严钦元;方景礼.塑料电镀[M].重庆:重庆出版社,1987:1-2. |
| [2] | 刘仁志.非金属电镀与精饰--技术与实践[M].北京:化学工业出版社,2006:2-3. |
| [3] | 匡新谋,郑长征,杨红智,苏敏茹,吉长友.ABS塑料化学镀铜工艺的研究[J].西安工程大学学报,2009(01):31-34. |
| [4] | 张怀武;何为;胡文成.现代印制电路原理与工艺[M].北京:机械工业出版社,2006:147. |
| [5] | 田庆华,闫剑锋,郭学益.化学镀铜的应用与发展概况[J].电镀与涂饰,2007(04):38-41. |
| [6] | Silvain JF.;Trombert S.;Chazelas J. .Copper electroless deposition on NiTi shape memory alloy: an XPS study of Sn-Pd-Cu growth[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2000(4):211-217. |
| [7] | Lee C Y;Huang T H .Elcetroless copper empelying hypophosphite as a reducing agent[P].US,6046107,2000-04-04. |
| [8] | 余晓皎,张洵亚,范薇,余中.ABS塑料化学镀铜工艺[J].电镀与涂饰,2007(05):10-12. |
| [9] | Honma H;Fujinami T;Terashima Y et al.Electroless copper plating solution and method for electmless copper plating[P].US,6193789,2001-02-27. |
| [10] | Honma H;Fujinami T;Ebina N .Micropomus copper film and electroless copper plating solution for optaining the salne[P].US,6329072,2001-12-11. |
| [11] | 葛圣松;孙宏飞;邵谦 等.ABS塑料低温快速化学镀铜的研究[J].山东科学,1999,12(03):57-60. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%