LQFP塑封电路第二焊线区分层影响因素分析

电镀与精饰 , 2012, 34(7): 25-30. doi: 10.3969/j.issn.1001-3849.2012.07.006

LQFP塑封电路第二焊线区分层影响因素分析

王津生 ^1, , 叶德洪 ^2, , 高伟 ^3, , 陈泉 ^4, , 郭会会 ^5,

1.飞思卡尔半导体(中国)有限公司,天津 300385

2.飞思卡尔半导体(中国)有限公司,天津 300385

3.飞思卡尔半导体(中国)有限公司,天津 300385

4.飞思卡尔半导体(中国)有限公司,天津 300385

5.飞思卡尔半导体(中国)有限公司,天津 300385

关键词：薄型四方扁平封装技术 , 第二焊线区分层 , 塑封胶 , 电镀 , 焊线 , 引线框架

An Effecting Factor Analysis on Second Bond Delamination in LQFP Packages

讨论了在薄型四方扁平封装技术在封装形式中影响塑封胶材料和第二焊线区之间的分层因素,从封装工艺控制,封装材料的使用及框架设计等诸多影响因素中进行了分析实验.结果显示,虽然封装过程中的工艺参数会影响第二焊线区的分层,但通过选择更合适的塑封胶材料及引线框架,不仅可以消除封装后的分层,还可以显著改善可靠性试验后的分层结果.所有实验结论都是在统计分析软件对实验数据进行统计分析后得出的.

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LQFP塑封电路第二焊线区分层影响因素分析

An Effecting Factor Analysis on Second Bond Delamination in LQFP Packages

参考文献