欢迎登录材料期刊网

材料期刊网

高级检索

以酒石酸盐为络合剂,胺化合物为辅助络合剂,研究钢铁基体上碱性无氰镀铜工艺,探讨了搅拌、镀液温度、pH、ρ(Cu2+)和添加剂对镀层外观的影响.考察了镀液的深镀能力和抗Fe2+、Fe3+、Zn2+及Sn4+杂质能力以及镀层与铁基体的结合力.实验结果表明:可以在宽广的工艺条件下获得光亮的铜镀层;阴极电流效率随温度、pH和ρ(Cu2+)提高而增大,在实验确定的工艺条件下ηκ为82%左右;镀液深镀能力达91%;计时电位曲线试验结果表明,基体上的钝化膜在沉积初期被破坏而处于活化状态,使得铜镀层与钢铁基体有足够的结合力.

参考文献

[1] De Almeida MRH.;Carlos IA.;Barbosa LL.;Carlos RM.;Lima-Neto BS. Pallone EMJA. .Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte[J].Journal of Applied Electrochemistry,2002(7):763-773.
[2] Barbosa LL;de Almeida MRH;Carlos RM;Yonashiro M;Oliveira GM;Carlos IA .Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film[J].Surface & Coatings Technology,2005(2/3):145-153.
[3] Gerasimenko A. A.;Krivoruchko M. P. .Enhancing the adhesion of copper electroplates to steel substrates. cyanide-free alkaline baths[J].Protection of Metals,2000(3):285-288.
[4] 邹忠利,李宁,王殿龙,黎德育.钢铁基体无氰碱性镀铜的研究进展[J].电镀与环保,2008(02):9-13.
[5] Tomaszewski L C;Tremmel R A .Cyanide-free copper plting process[P].United States Patent:4462874,1984-07-31.
[6] Brasch W R .Cyanide-free monovalent copper electroplating solutions[P].United States Patent:5750018,1998-05-12.
[7] Stewart R;Steinecker C .Non-cyanide copper plating process for zinc and zinc alloys[P].United States Patent:6827834,2004-12-07.
[8] Kline G A .Cyanide-free copper plating process[P].United States Patent:4933051,1990-06-12.
[9] Szotek J .Purification of cyanide-free copper plating baths[P].United States Patent:5266212,1993-11-30.
[10] Nobel F I;Brasch W R;Drago A J .Cyanide-free plating solutions for monovalent metals[P].United States Patent:5302278,1994-04-12.
[11] 蔡爱清,王建华,曹相锋.碱性无氰镀铜工艺研究[J].电镀与精饰,2007(03):45-47.
[12] 邵晨,冯辉,卫应亮,邵同镜.膦酸镀铜新工艺的研究[J].内蒙古石油化工,2007(02):20-23.
[13] Jayakrishnan S;Vinothini A;Kala C et al.Electroplating of copper from an amine based noncyanide bath[J].Transactions of the Institute of Metal Finishing,2001,79(05):171-174.
[14] Tharamani C;Maruthi B N;Mayanna S M .Development of a non-cyanide alkaline bath for industrial copper plating[J].Transactions of the Institute of Metal Finishing,2002,80(02):37-39.
[15] S S KULKARNI;C D LOKHANDE .ELECTRODEPOSITION OF NANOCRYSTALLINE COPPER FROM VARIOUS BATHS[J].Bulletin of electrochemistry,2003(11):521-524.
[16] 冯绍彬,刘清,冯丽婷,包祥.电沉积与铁基体电位活化的增强拉曼光谱研究[J].材料保护,2007(01):5-7.
[17] 冯绍彬,胡芳红."电位活化"现象与无氰直接镀铜[J].电镀与涂饰,2008(03):4-6,11.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%