在电子工业中,平版印制技术在印制电路板制造中被广泛采用,传统制造方法其加工过程至少需要六道工序,在刻蚀过程中大量的金属原材料被丢弃,对板材的腐蚀使其选材受到限制.而以喷墨印制技术为核心的全印制电子技术只要打印和固化两道工序即可,非常简便.对要求不高的电子产品,如电子标签,一般不需要后续化学镀和电镀.对导电线路要求高的,需用化学镀来增厚光滑线路表观和改善线路导电性能.如要求线路厚度高于12 μm以上,则需电镀增厚.该工艺所用导电墨水,在表面处理技术中也有着广泛用途.
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