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将至今所使用的酸性镀铜添加剂分成六类进行了归纳叙述;简述近年来的各种物理因素例如脉冲技术、超声波技术、激光技术等在酸性镀铜中的应用现状及其对镀层质量的影响;总结应用阴极极化曲线、交流阻抗、微分电容等测试方法研究添加剂电化学行为和用扫描电镜、X-射线衍射、原子力显微镜等研究镀层结构来探讨酸性镀铜的沉积机理的一般方法.

参考文献

[1] 曾华梁;吴仲达;秦月文.电镀工艺手册[M].北京:机械工业出版社,1989:158.
[2] 胡信国.现代防护装饰性电镀[M].哈尔滨:哈尔滨工业大学出版社,1989:161.
[3] Cope B P;Harrover R E Jr et al.Acid copper addition agent[P].US 2972572,1958-12-09.
[4] Wennemar Strauss;Wolf-Dieter Willmund;Dusseldof-Holthausen et al.Baths for the production of copper electroplates[P].US:3051634,1962-08-28.
[5] Bernard Boudot;Paris;Georges Nury et al.Additive composition, bath and process for acid copper electroplating[P].US:4430173,1984-02-07.
[6] Roger F Bernards;Wellesley;Gordon Fisher et al.Additive for acid-copper electroplating baths to increasing throwing power[P].US 5051154,1991-09-24.
[7] Jonathan David reid;Sherwood;Oreg .Electroplating additive for filling sub-micron features[P].US:6024857,2000-02-15.
[8] Devaraj G;Seshadri S K .Pulsed electroplating of copper[J].Plating and Surface Finishing,1992,79(08):72-78.
[9] C.H. Seah;S. Mridha;L.H. Chan .DC/pulse plating of copper for trench/via filling[J].Journal of Materials Processing Technology,2001(3):233-239.
[10] 羊秋福,韩苗兴.脉冲电源在印制电路板镀铜上的应用[J].电镀与精饰,2003(03):18-19.
[11] Stoychev D S;Aroyo M S .The influence of pulse frequency on the hardness of bright copper electrodeposits[J].Plating and Surface Finishing,1997,84(08):26-28.
[12] Aroyo M;Tzonev N .Pulse periodic reverse plating-possibilities for electrodeposition of metal coatings with improved properties[J].Plating and Surface Finishing,2003,90(02):50-54.
[13] Peter Kristof;Mark Pritzker .Improved copper plating through the use of current pulsing & ultrasonic agitation[J].Plating & Surface Finishing,1998(11):237-240,244-0.
[14] Vasuoevan R;Devanathan R;Chidambaram K G.Effect of ultrasonic agitation during electroplating of nickel and copper at room temperature[J].Metal Finishing,1992(10):23-26.
[15] Chiba A;Wu W C .Ultrasonic agitation effects on the electrodeposition of copper[J].Plating and Surface Finishing,1992,79(12):62-66.
[16] Richard Menini;Boucherville;Joel fournier et al.Ultrasonic assisted plating bath for vias metallization in printed circuit boardmanufacturing[P].US:6398937,2002-06-04.
[17] Hsiao M C;Wan C C .The effect of ultrasonic agitation on copper plating in an acid bath[J].Plating and Surface Finishing,1989,76(30):46-50.
[18] Von Guttfeld R J;Tynan E E;Melcher R L et al.Laser-enhanced electroplating and maskless pattern generation[J].Applied Physics Letters,1979,35(09):651-653.
[19] Puippe J G;Acosta R E;Von Guttfeld R J .Investigation of laser-enhanced electroplating mechanisms[J].Journal of the Electroplating Society,1981,128(12):2539-2545.
[20] 张胜涛.电镀工程[M].北京:化学工业出版社,2002:34.
[21] 杨防祖,黄令,许书楷,姚士冰,陈秉彝,周绍民.添加剂的整平能力及其对Cu电沉积层结构的影响[J].厦门大学学报(自然科学版),2003(01):56-59.
[22] Jae Jeong Kim;Soo-Kil Kim;Jong-Uk Bae .Investigation of copper deposition in the presence of benzotriazole[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2002(1/2):101-107.
[23] Yoon S;Schwartz M;Nobe K .Rotating ring-disk electrode studies of Cu anodes: effect of chloride ions and organic additive[J].Plating and Surface Finishing,1995,82(02):64-69.
[24] Yoon S;Schwartz M;Nobe K .Rotating ring-disk electrode studies of copper electrodeposition : effect of chloride ions and organic additives[J].Plating and Surface Finishing,1994,81(12):65-73.
[25] Reinchenbach D .Testing of copper plating by rotating cone electrode[J].Plating and Surface Finishing,1994,81(05):106-109.
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