采用正交试验探索硅烷偶联剂Si-69的水解工艺条件,研究了Si-69用量、水解pH值、水解时间等水解因素和老化成膜条件(温度、时间)对硅烷成膜试样耐蚀性的影响,确定了最佳水解工艺和老化成膜工艺.经电化学测试表明,硅烷膜的生成使2024铝合金基体表面的多孔性降低,有效阻止了腐蚀介质所参与的阴极活性点还原反应,极大地提高了基体的耐蚀性.
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