用一般的电子陶瓷工艺在中温(1150℃)烧结条件下制备了(Zr,Sn)TiO4系统多层陶瓷电容器(MLCC)用高频陶瓷材料.通过向系统中加入CuO,ZnO,BaCO3,SrCO3和G(玻璃)等添加剂,达到了降低烧成温度并提高介电性能的效果.研究了各添加剂对系统介电性能的影响.制得的陶瓷材料具有优异的介电性能:在1MHz下,ε≈38,Q=1/tan δ≥104,ρV≥1011Ω·m,αC=(0±30)×10-6·℃-1.
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