研究了CaO-B2O3-SiO2系微晶玻璃的烧结过程、析晶机制、微观结构以及介电性能等.该材料能够在850℃的低温烧结,烧结体具有良好的介电性能(εr＝4.975,tgδ≤0.001,1GHz).微观结构主要为75%～80%体积百分比的晶相(晶粒尺寸为50～100nm)、少量的残余玻璃相和气孔;主要晶相为CB(CaO.B2O3)、C6S4(6CaO.4SiO2)和CS(CaO.SiO2).该材料适用于高频电子元器件等领域.
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