考察了在覆盖有分散Pd粒子的非导体表面电沉积铜的初始阶段,发现非导体在电沉积前的面电阻达到100MΩ/cm时可实现较快速度的电沉积.铜层生长前沿分为厚镀层区和薄镀层区两部分,厚镀层区外观为红色,形成致密的结晶;薄镀层区颜色发黑,小的铜晶粒在高能表面首先生成.离挂具点近的地方结晶致密,反之则结晶稀疏.SEM照片显示出最初沉积的铜层是以Pd为沉积点的不规则块状,其大小为2～5μm2,随后在众多连续状上有晶体缺陷的高能表面沉积出具有立方形状的铜晶体.电沉积铜过程的推动力是生长前沿高达106A/dm2的电流密度,先沉积的铜层起到挂具的作用直到非金属表面被完全覆盖.
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