超重力技术是一种利用离心机产生强大的离心加速度来进行操作的新型技术,因而在科学技术研究领域得到了广泛的应用.主要介绍了超重力技术的基本原理,并较全面地综述了近年来超重力技术在电沉积中的应用情况.
参考文献
[1] | Mallinon R;Ramshaw C .[P].EP 2568B,1979. |
[2] | 超重力技术[J].化工科技市场,2003,26(02):71-72. |
[3] | Santos S G;Martins L F O;Ajello P C T D' et al.Electroless and electroplating of Cu on Si[J].Microelectronic Engineering,1997,33(1-4):59. |
[4] | X. Cheng;G. Li;E. A. Kneer;B. Vermeire;H. G. Parks;S. Raghavan;J. S. Jeon .Electrochemical impedance spectroscopy of copper deposition on silicon from dilute hydrofluoric acid solutions[J].Journal of the Electrochemical Society,1998(1):352-357. |
[5] | M. Cerisier;K. Attenborough;J. Fransaer;C. Van Haesendonck;J. -P. Celis .Growth mode of copper films electrodeposited on silicon from sulfate and pyrophosphate solutions[J].Journal of the Electrochemical Society,1999(6):2156-2162. |
[6] | Magagnin L;Maboudian R;Carraro C .Selective deposition of thin copper films onto silicon with improved adhesion[J].Electrochemical and Solid-State Letters,2001,4(01):C5. |
[7] | Ji CX.;Searson PC.;Oskam G. .Electrochemical nucleation and growth of copper on Si(111)[J].Surface Science: A Journal Devoted to the Physics and Chemistry of Interfaces,2001(1/2):115-124. |
[8] | Ali Eftekhari .Improving Cu metallization of Si by electrodeposition under centrifugal fields[J].Microelectronic engineering,2003(1):17-25. |
[9] | 邵光杰,马焕明,王海燕,荆天辅,姚枚.离心高速电镀镍工艺研究[J].电镀与涂饰,2000(02):10-12. |
[10] | Ali Eftekhari .Enhanced stability and conductivity of polypyrrole film prepared electrochemically in the presence of centrifugal forces[J].Synthetic Metals,2004(1/3):305-308. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%