随着电子元器件和高密度、高精度多层印制电路板在航天、航空、航海、遥感等领域中获得广泛应用,化学镀金取得了惊人的进展,并有取代电镀金之趋势,为镀金业带来新的生机.文中针对化学镀金中镀液组分的主盐与络合剂、稳定剂和缓冲剂的筛选与优化等关键技术进行了研究和阐述.
参考文献
| [1] | Edward B Saubestre .Electroless plating of today[J].Metal Finishing,1992,90(12):38-42. |
| [2] | Rajagopal I;Rajam K S .Electroless Nickel Depostion from Triethanolam-ine Bath (PartⅠ):Bath Characleristics[J].Metal Finishing,1990,88(10):41-45. |
| [3] | Sharma A K .Electrodeposition of Gold on Magnesium-Lithium Alloys[J].Metal Finishing,1988,86(12):33-44. |
| [4] | Electroless plating of gold-for esp electronic components and circuits[P].UKP1322203,1973. |
| [5] | Electroless gold plating bath-contg:alkali metal cyanoborohydride[P].UKP1321963,1973. |
| [6] | Direct electroless gold plating-on tungsten and molybdenum,using alkaline plating soln[P].GP2239676,1973. |
| [7] | Magnetic storage medium-active layer deposited on anodized aluminium base and heat hardened[P].US:3721613,1973. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%