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采用不同钯含量的Ag-Cu-Ti-Pd活性钎料真空钎焊连接Si3N4陶瓷与40CrMo钢,对其接头组织与性能进行了研究.结果表明:钎焊过程中,钎料中的活性元素钛与钎料两侧的母材反应分别在陶瓷/钎料和钢/钎料界面形成了TiN+Ti5Si3及Fe-Ti化合物反应层;随着钎料中钯含量(原子分数)由5%提高到20%,接头中反应层的厚度和反应产物的分布发生了变化,接头的连接强度呈现出先增大后降低的趋势.

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