研究了Cu-25.04Zn-3.83Al-0.2Zr形状记忆合金的ECAP过程以及不同温度挤压后组织和性能的变化.结果表明:在200℃挤压时加工硬化严重,无法进行多次挤压,250℃虽无明显的加工硬化,但挤压多次会出现裂纹,350℃挤压晶粒长大比较严重,较佳ECAP温度为300℃;合金在300℃经过一次挤压后,硬度从149 HB陡增到252 HB,随着挤压次数的增加,硬度略有增加并趋于稳定,达到275 HB左右;合金在300℃挤压后,晶粒虽无明显减小,但晶界更加清晰,晶粒更加规则,形成了具有大角度晶界的等轴晶,微观组织得到优化.
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