因为吸氢严重,一般的沉积工艺得到的钯镀层上存在气孔、裂纹等缺陷.利用正交设计研究了钯选择性电沉积过程.发现在移动阳极的作用下,钯选择性电沉积中离子扩散速度加快,使控制步骤由一般电沉积的扩散和电化学联合控制转为主要由电化学控制.AFM观察表明,镀层没有出现裂纹和气孔,质量颇好.
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