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采用输运电流方法测试了37芯Bi2223带材的平均错配角.带材的错配角随带材厚度的降低而减小,同时带材Jc升高.但过薄的带材由于加工不稳定易导致Ag/超界面不规则现象,并破坏界面晶粒取向,造成错配角增大.

参考文献

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[8] D. Bourgault;E. Flahaut;A. Antonevici .Influence of filament thickness, thermal process and magnetic field on misalignment angles in multifilament Bi2212 tapes[J].Cryogenics,2004(10):681-686.
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