采用输运电流方法测试了37芯Bi2223带材的平均错配角.带材的错配角随带材厚度的降低而减小,同时带材Jc升高.但过薄的带材由于加工不稳定易导致Ag/超界面不规则现象,并破坏界面晶粒取向,造成错配角增大.
参考文献
[1] | P H Kes et al.[J].Physical Review Letters,1990,64:1063. |
[2] | W E Lawrence et al.Proceedings of the Twelfth International Conference on Low Temperature Physics[J].Japan,KyoTo,970:361. |
[3] | G Grasso et al.[J].Physica C,1995,250:43. |
[4] | Q Y Hu et al.[J].Physica C,1995,252:211. |
[5] | H Iwasaki et al.[J].Physica C,1995,244:71. |
[6] | D Bourgault;E Flahaut;A Antonevici .Misalignment angles and the 2D-3D temperature crossover in Bi2212 multifilaments studied using transport critical current densities[J].Superconductor Science & Technology,2004(3):463-468. |
[7] | B Hensel et al.[J].Physica C,1993,205:329. |
[8] | D. Bourgault;E. Flahaut;A. Antonevici .Influence of filament thickness, thermal process and magnetic field on misalignment angles in multifilament Bi2212 tapes[J].Cryogenics,2004(10):681-686. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%