采用低压化学气相沉积法(LPCVD)以铜箔为生长衬底来制备石墨烯.XRD表征得石墨烯生长前后铜箔衬底主要为(100)晶面,而且铜箔在高温下退火晶粒明显长大有利于高质量石墨烯的生长.拉曼光谱表明所制备的石墨烯为双层结构.通过转移、刻蚀等工艺制备了石墨烯场效应晶体管(G-FET)原型器件,其转移特性曲线(IDS-VGS)表明所制备的石墨烯表现为p型输运特性.在器件中石墨烯的XPS图谱说明了石墨烯吸附有有机物基团,导致p型特性的部分原因.同时本文研究了真空退火对G-FET器件性能的影响,结果表明:退火温度为200℃时,G-FET的空穴载流子迁移率最佳；而随着温度增加,开关比(ON-OFF ratio)在不断减小,载流子迁移率迅速在降低.
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