用Ag-Cu-Tj活性钎料对C/SiC复合陶瓷与Nb合金进行了真空钎焊.结果表明,适合该陶瓷钎焊的Ag-Cu-Ti钎料的Ti含量以2.5%～3.0%(质量分数)为宜;但Ag-Cu-Ti2.5钎料直接钎焊陶瓷与金属,焊缝及陶瓷一侧有裂纹和孔洞等缺陷;钎料中引入Mo颗粒后有效缓解了残余应力,实现了陶瓷与金属的气密连接.界面反应产物主要是TiC,TiSi,Cu4Tu,Cu3Ti.
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