金刚石/Cu复合材料是性能优异的新型高导热低膨胀热管理材料.采用金刚石经表面镀Ti或Cr后再镀Cu, SPS烧结制备金刚石/Cu复合材料.结果表明: 金刚石/Cu复合材料的烧结致密化与金刚石的体积分数、粒度大小、烧结温度及形成的金刚石/金属间的界面相关.金刚石的体积分数对烧结致密化影响最大, 烧结温度影响最小; 随金刚石体积分数和粒度的增加, 金刚石/Cu复合材料的烧结致密化难度增大.
参考文献
| [1] | Davidson H L;Colella N J;Kerns J A.Copper/diamond composites substrates for electronic components[J].IEEE,1995:538. |
| [2] | Wildner H;Knippscheer S;Landgraf J .Manufacturing and applications of diamond-composites for thermal management[R].EMPA,2006-11-10. |
| [3] | Carl Zweben .Advances in composite materials for thermal management in electronic packaging[J].JOM,1998(6):47-51. |
| [4] | Carl Zweben .Thermal Materials Solve Power Electronics Challenges[J].Power Electronics Technology,2006(2):40-47. |
| [5] | L. Weber;R. Tavangar .On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites[J].Scripta materialia,2007(11):988-991. |
| [6] | Beffort O .Interface formation in infiltratedAl(Si)/diamond composites[J].Diamond and Related Materials,2006,15:1250. |
| [7] | Ruch P W;Beffort O.Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites Science and Technology,2006(66):2677. |
| [8] | Kerns J A;Colella N J;Makoiecki D.Dymalloy:A composite substrate for high power density electronic components[A].,1995:66. |
| [9] | Nishibayashi;Yoshiki .Heat sink for semiconductors and manufacturing process thereof[P].US 6031285,2000. |
| [10] | Weber L;Tavangar R .Metal/diamond composites for heat sink applications Laboratory of Mechanical Metallurgy[OL].http://lmm.epfl.ch/lmm/research/ MetDiam_composites.html |
| [11] | 宋月清,康志君,高云.金刚石与金属（或合金）的结合界面分析[J].人工晶体学报,1999(04):404-408. |
| [12] | 李国彬,王铁宝,邓春岩.金刚石表面镀钛及界面微结构的研究[J].金刚石与磨料磨具工程,2007(02):14-16,19. |
| [13] | 朱永法,王莉,姚文清,曹立礼.金刚石颗粒表面Cr金属化及薄膜间界面扩散反应的研究[J].高等学校化学学报,2000(08):1269-1272. |
| [14] | Yasuyukii AGARI;Inoue Kanryu;Mizuuehi Kiyoshi.Thermal conductivity of copper composites dispersed with diamond particles prepared by spark plasma sintering[A].Kyoto,Japan,2006:328. |
| [15] | 韩于羹.应用数理统计[M].北京:北京航空航天大学出版社,1989:3. |
| [16] | Yoshida K;Morigami H.Thermal properties of diamond/copper composite material[J].Microelectronics Reliability,2004(44):303. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%