{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"通过改变SU-8光刻胶中PAG浓度获得含不同PAG浓度的各种改性SU-8光刻胶,在对其光学性能以及最小曝光剂量的测定基础上研究改性SU-8光刻胶的光刻工艺,借助于改性SU-8光刻胶的合理设计以及背面曝光和正面曝光的结合应用提高多元材料复杂结构的集成制造能力.","authors":[{"authorName":"朱军","id":"ec770568-32ba-47ec-acd6-2c5498b1e9fc","originalAuthorName":"朱军"},{"authorName":"蒋宏民","id":"48193798-8acd-4273-965f-98e648b4027f","originalAuthorName":"蒋宏民"},{"authorName":"陈翔","id":"dacdbf85-dfa3-4118-ad5a-a005173ebbee","originalAuthorName":"陈翔"},{"authorName":"陈迪","id":"45ce2355-72a6-4453-8168-2e319df26c8c","originalAuthorName":"陈迪"},{"authorName":"刘景全","id":"9317fde9-8900-47ef-85a2-57a0c638868f","originalAuthorName":"刘景全"}],"doi":"10.3969/j.issn.1007-4252.2009.03.009","fpage":"259","id":"dcd046b2-7c6b-44a5-b7ee-3a44371e0f03","issue":"3","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报 "},"keywords":[{"id":"54c24b04-877d-446d-9f03-be15c55e1e31","keyword":"最小曝光剂量","originalKeyword":"最小曝光剂量"},{"id":"ab34b1c2-47da-4d9a-a6e0-5dba289535f0","keyword":"PAG","originalKeyword":"PAG"},{"id":"40c5ad50-b6ce-428c-8128-fdf6b84db493","keyword":"集成制造","originalKeyword":"集成制造"}],"language":"zh","publisherId":"gnclyqjxb200903009","title":"改性SU8光刻胶的光学特性及其工艺","volume":"15","year":"2009"},{"abstractinfo":"溅射靶材常用于半导体产业、记录媒体产业和先进显示器产业. 在不同产业中, 半导体集成电路制造业对溅射靶材的质量要求最高. 对用于集成电路制造的溅射靶材的材质类型、纯度要求、外形发展进行了阐述, 并讨论了溅射靶材微观组织对溅射薄膜性质的影响, 以及靶材中夹杂物、晶粒尺寸、晶粒取向的控制方法.","authors":[{"authorName":"尚再艳","id":"e1afd132-13b0-45ea-8f07-d259d3cd67dd","originalAuthorName":"尚再艳"},{"authorName":"江轩","id":"dd4eefac-2ef1-4f80-944b-fea803460373","originalAuthorName":"江轩"},{"authorName":"李勇军","id":"0e8f34eb-f740-459c-910c-d6e31b49915a","originalAuthorName":"李勇军"},{"authorName":"杨永刚","id":"d354b7ef-f862-483f-a296-028c7f7ecbad","originalAuthorName":"杨永刚"}],"doi":"10.3969/j.issn.0258-7076.2005.04.022","fpage":"475","id":"7636e988-0e0a-4ef3-8975-70960dc79fdc","issue":"4","journal":{"abbrevTitle":"XYJS","coverImgSrc":"journal/img/cover/XYJS.jpg","id":"67","issnPpub":"0258-7076","publisherId":"XYJS","title":"稀有金属"},"keywords":[{"id":"0ed296a9-62cb-459b-996b-97fa0cf775fa","keyword":"集成电路","originalKeyword":"集成电路"},{"id":"66ae37d0-1f59-4196-bf02-3af046d5eab6","keyword":"溅射","originalKeyword":"溅射"},{"id":"35d719a7-0c30-449b-bad9-78eff5a90a6a","keyword":"靶材","originalKeyword":"靶材"},{"id":"e2832166-b385-4b85-bc0a-25c1ce4a31eb","keyword":"半导体","originalKeyword":"半导体"}],"language":"zh","publisherId":"xyjs200504022","title":"集成电路制造用溅射靶材","volume":"29","year":"2005"},{"abstractinfo":"对钢铁制造流程中若干深层次的理论问题进行了科学分支意义上的讨论, 对工序功能集的解析-优化、工序关系集的协调-优化和流程工序集的集成-优化等给予物理-数学方面的概述和描述, 提出了对可能发展起来的学科分支-冶金流程学的展望, 同时进一步指出, 制造流程的系统理论和制造过程的信息系统是21世纪制造科学、制造工业发展的共性基础理论.","authors":[{"authorName":"殷瑞钰","id":"c741367e-16af-49f9-a3f0-ede0a65cf3d7","originalAuthorName":"殷瑞钰"}],"categoryName":"|","doi":"","fpage":"1077","id":"de1f9656-a4ff-49f3-9ff4-1598d95119ca","issue":"10","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"3aebf78c-9a40-478a-acd5-63dac7dc7c7d","keyword":"钢铁制造流程","originalKeyword":"钢铁制造流程"},{"id":"603880bd-e89a-4dcb-89b8-abfd92630f55","keyword":"null","originalKeyword":"null"},{"id":"ea5fc26e-26d1-4ac4-8a16-b16c2ec7718d","keyword":"null","originalKeyword":"null"}],"language":"zh","publisherId":"0412-1961_2000_10_16","title":"钢铁制造流程的解析和集成","volume":"36","year":"2000"},{"abstractinfo":"对钢铁制造流程中若干深层次的理论问题进行了学科分支意义上的讨论.对工序功能集的解析-优化、工序关系集的协调-优化和流程工序集的集成-优化等给予物理-数学方面的概括和描述,提出了对可能发展起来的学科分支--冶金流程学的展望.同时进一步指出,制造流程的系统理论和制造过程的信息系统是21世纪制造科学、制造工业发展的共性基础理论.","authors":[{"authorName":"殷瑞钰","id":"886f5548-0c20-412f-b66b-c04b799b1159","originalAuthorName":"殷瑞钰"}],"doi":"10.3321/j.issn:0412-1961.2000.10.015","fpage":"1077","id":"060dec5d-3f76-4106-bd81-c589c04ea93f","issue":"10","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"9f908993-078d-488a-9a75-f035b87fcd13","keyword":"钢铁制造流程","originalKeyword":"钢铁制造流程"},{"id":"9f2ce24b-fa13-41dd-b969-f63d7eec3186","keyword":"解析与集成","originalKeyword":"解析与集成"},{"id":"62c6e4dc-285a-4120-960b-88acb4d208a4","keyword":"工序功能集","originalKeyword":"工序功能集"},{"id":"c963e029-76ed-49df-8a34-a39d2c7b2a18","keyword":"工序关系集","originalKeyword":"工序关系集"},{"id":"219d5f77-abde-4709-bf5a-f1dead16d228","keyword":"流程工序集","originalKeyword":"流程工序集"},{"id":"42dd07ce-91fc-4d42-bbdc-fb893951adfd","keyword":"冶金流程学","originalKeyword":"冶金流程学"}],"language":"zh","publisherId":"jsxb200010015","title":"钢铁制造流程的解析和集成","volume":"36","year":"2000"},{"abstractinfo":"集成电路制造用溅射靶材的绑定技术,又称焊接或粘接技术,是溅射机台设计和制造工程师、溅射靶材开发生产工程师、以及集成电路制造工艺和设备工程师共同关心的问题,通过对比研究机械连接、钎焊、胶粘结、扩散焊、电子束焊和爆炸焊的应用条件和优缺点,增进溅射靶材设计、生产和使用相关工程师对靶材绑定技术的交流和认识.","authors":[{"authorName":"雷继锋","id":"be3e36d6-de2c-4995-896b-801edfe14522","originalAuthorName":"雷继锋"}],"doi":"","fpage":"48","id":"e74165ff-ad26-48ad-93c1-241080ea3974","issue":"1","journal":{"abbrevTitle":"JSGNCL","coverImgSrc":"journal/img/cover/JSGNCL.jpg","id":"46","issnPpub":"1005-8192","publisherId":"JSGNCL","title":"金属功能材料"},"keywords":[{"id":"67e41985-aed0-49cf-b526-1e7d485eba15","keyword":"溅射靶材","originalKeyword":"溅射靶材"},{"id":"e4279b4e-e4b9-46a3-a21e-0dc10db428e3","keyword":"钎焊","originalKeyword":"钎焊"},{"id":"b432f56a-1ddb-43a2-a870-45205d138995","keyword":"扩散焊","originalKeyword":"扩散焊"},{"id":"bb000912-ff81-41c0-96cd-c59128949785","keyword":"电子束焊","originalKeyword":"电子束焊"},{"id":"856648a3-7f36-44ed-9529-519477301b4a","keyword":"爆炸焊","originalKeyword":"爆炸焊"}],"language":"zh","publisherId":"jsgncl201301010","title":"集成电路制造用溅射靶材绑定技术相关问题研究","volume":"20","year":"2013"},{"abstractinfo":"研究并讨论了高效率、低成本洁净钢"制造平台"的概念、定义、内涵、边界和动态运行的规则和方法。指出高效率、低成本洁净钢"制造平台"不仅有质量含义、技术含义,而且有市场含义、经济含义。高效率、低成本洁净钢"制造平台"建设是钢厂今后技术进步过程中具有基础性、普适性并事关效率、质量、成本的共性关键技术之一,不仅适用在"高端产品"研发和生产,也适用于大宗普通商品钢材的生产过程。高效率、低成本洁净钢制造平台是现代炼钢技术进步的重要方向,对每个钢厂的市场竞争力具有重要意义。高效率、低成本洁净钢"制造平台"的研究不仅涉及钢厂的生产技术和管理,而且涉及到学术研究领域(过程工程及其动态运行)和工程设计的理论和方法创新(动态-精准设计的理论与方法)。高效率、低成本洁净钢"制造平台"的集成理论和方法是冶金过程工程与材料工程的结合点。","authors":[{"authorName":"殷瑞钰","id":"139fbb57-9a6c-4908-9842-45f478671e9d","originalAuthorName":"殷瑞钰"}],"doi":"","fpage":"1","id":"56f04a2f-12ee-4e7e-9ee5-be57ed9e7120","issue":"1","journal":{"abbrevTitle":"GT","coverImgSrc":"journal/img/cover/GT.jpg","id":"27","issnPpub":"0449-749X","publisherId":"GT","title":"钢铁"},"keywords":[{"id":"204cc612-51bf-438d-9c67-bb152ecab080","keyword":"高效率","originalKeyword":"高效率"},{"id":"8428b8e4-2157-45d1-b700-837728304ba3","keyword":"低成本洁净钢","originalKeyword":"低成本洁净钢"},{"id":"3636cbd9-7283-4807-ba12-63173d5bad9e","keyword":"制造平台","originalKeyword":"制造平台"},{"id":"1d5272f2-7e09-434c-a780-938875652e14","keyword":"集成技术","originalKeyword":"集成技术"},{"id":"690d5790-bc55-4749-ba93-3dae889a8306","keyword":"动态运行","originalKeyword":"动态运行"}],"language":"zh","publisherId":"gt201201001","title":"高效率、低成本洁净钢“制造平台”集成技术及其动态运行","volume":"47","year":"2012"},{"abstractinfo":"研究并讨论了高效率、低成本洁净钢“制造平台”的概念、定义、内涵、边界和动态运行的规则和方法。指出高效率、低成本洁净钢“制造平台”不仅有质量含义、技术含义,而且有市场含义、经济含义。高效率、低成本洁净钢“制造平台”建设是钢厂今后技术进步过程中具有基础性、普适性并事关效率、质量、成本的共性关键技术之一,不仅适用在“高端产品”研发和生产,也适用于大宗普通商品钢材的生产过程。高效率、低成本洁净钢制造平台是现代炼钢技术进步的重要方向,对每个钢厂的市场竞争力具有重要意义。高效率、低成本洁净钢“制造平台”的研究不仅涉及钢厂的生产技术和管理,而且涉及到学术研究领域(过程工程及其动态运行)和工程设计的理论和方法创新(动态-精准设计的理论与方法)。高效率、低成本洁净钢“制造平台”的集成理论和方法是冶金过程工程与材料工程的结合点。","authors":[{"authorName":"殷瑞钰","id":"2117316b-0cb1-44d5-b41f-97ea8b1b3ae1","originalAuthorName":"殷瑞钰"}],"categoryName":"|","doi":"","fpage":"1","id":"f20cd58d-9fbc-445d-8ddd-f82704d69155","issue":"1","journal":{"abbrevTitle":"GT","coverImgSrc":"journal/img/cover/GT.jpg","id":"27","issnPpub":"0449-749X","publisherId":"GT","title":"钢铁"},"keywords":[{"id":"17d297c5-2e19-4d24-a7f4-acc521b721a6","keyword":"高效率 ","originalKeyword":"高效率 "},{"id":"46eb4794-59ee-4a67-83c9-beea9b0b4a44","keyword":" low cost clean steel ","originalKeyword":" low cost clean steel "},{"id":"de08c6f9-4974-4c94-9b6b-177db3025ff6","keyword":" production platform ","originalKeyword":" production platform "},{"id":"1eba169b-3e93-43b1-afcf-c7b2a8b435c1","keyword":" integration technology ","originalKeyword":" integration technology "},{"id":"7be4678d-c1be-4e02-9bbe-df3181b117a7","keyword":" dynamic operation","originalKeyword":" dynamic operation"}],"language":"zh","publisherId":"0449-749X_2012_1_12","title":"高效率、低成本洁净钢“制造平台”集成技术及其动态运行","volume":"47","year":"2012"},{"abstractinfo":"过程工程是指在开放的工程系统条件下,描述多因子、多尺度、多层次、多单元的过程及其系统行为并集成为动态运行系统的学问。在过程工程中,鲜明地体现为不同层次、不同尺度的过程之间的“纵向集成”,同时也呈现出“异质”的但又相关单元过程之间的“横向集成”。过程工程问题广泛地存在于冶金、化工、建材等流程制造业的生产运行和规划、设计之中。包括钢铁工业在内的流程制造业有着形式各异的企业,但这些企业有着共同的特征,即这些制造流程动态运行的物理本质是:“‘物质流’在‘能量流’的驱动和作用下,沿着设定的‘流程网络’,按照设定的‘程序’作动态-有序运行”。制造流程动态运行的要素是“流”、“流程网络”和“运行程序”。制造流程不仅涉及产品制造,还涉及能源转换和耗散、过程排放与环境-生态等。在理论阐述的基础上,讨论了钢铁制造流程动态运行的6条规则,这将对工程规划、设计,企业生产运行及其信息化、绿色化具有引导性。强调指出:制造流程是复杂的、动态的、整体性的工程系统,是多因子、多尺度、多单元、多层次整合-集成而成的整体,具有涌现性而非简单加和性。对制造流程而言,一切都是过程及其集成,一切都是开放-动态的过程并可形成结构不同的流程系统,其动态运行过程的实质是不同耗散结构中的耗散过程。","authors":[{"authorName":"殷瑞钰","id":"3911ef5d-62f8-4629-b2fe-b11a6cc1c92f","originalAuthorName":"殷瑞钰"}],"doi":"","fpage":"15","id":"a8db6389-e944-4a82-a9b5-81a77141b570","issue":"7","journal":{"abbrevTitle":"GT","coverImgSrc":"journal/img/cover/GT.jpg","id":"27","issnPpub":"0449-749X","publisherId":"GT","title":"钢铁"},"keywords":[{"id":"6c16fb09-2019-4802-8fe9-754836046320","keyword":"过程工程","originalKeyword":"过程工程"},{"id":"45680dae-30bd-407e-99ca-948d379e3ad7","keyword":"动态运行系统","originalKeyword":"动态运行系统"},{"id":"9d2c03c2-85da-4c79-9251-cc1469c5bb7c","keyword":"制造流程","originalKeyword":"制造流程"}],"language":"zh","publisherId":"gt201407004","title":"过程工程与制造流程","volume":"","year":"2014"},{"abstractinfo":"叙述了基于GaAsHBT的直接耦合级联形式,设计制造的几种微波单片集成电路,包括2.5Gb/s跨阻放大器、3GHz可级联放大器和10Gb/s跨阻放大器的设计、制造和测试结果.","authors":[{"authorName":"曾庆明","id":"4690e634-5aa4-48c3-b619-bd8863445de6","originalAuthorName":"曾庆明"},{"authorName":"徐晓春","id":"779db09f-553d-443a-8164-532c5fc85598","originalAuthorName":"徐晓春"},{"authorName":"刘伟吉","id":"54b99a5a-c832-44fa-9357-cc9d13a3480c","originalAuthorName":"刘伟吉"},{"authorName":"李献杰","id":"fba76444-f197-4f61-b366-8fdea808a9d1","originalAuthorName":"李献杰"},{"authorName":"敖金平","id":"67dbdea6-8e25-458b-adcb-afc0074255a4","originalAuthorName":"敖金平"},{"authorName":"王全树","id":"08dddce2-0f2e-4910-a976-d089e30f79ba","originalAuthorName":"王全树"},{"authorName":"郭建魁","id":"5edbd6bd-4fb9-4c11-b1fe-85f3226606af","originalAuthorName":"郭建魁"},{"authorName":"赵永林","id":"8907c351-e0ae-44e5-85bf-878f1f4223db","originalAuthorName":"赵永林"},{"authorName":"揭俊锋","id":"d3ea412f-6b24-40b5-957f-b0e1704528ec","originalAuthorName":"揭俊锋"}],"doi":"10.3969/j.issn.1007-4252.2000.03.018","fpage":"201","id":"bbe8e2cf-0a83-4e01-b789-6d2c2590427a","issue":"3","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报 "},"keywords":[{"id":"1fc9c270-e34a-42ad-84d7-f70e55b400c7","keyword":"GaAs","originalKeyword":"GaAs"},{"id":"f95a275b-3c0d-4508-b069-eb82886c3561","keyword":"HBT","originalKeyword":"HBT"},{"id":"2be24f00-07a4-4fc3-8705-a404a2783c0b","keyword":"微波单片集成电路","originalKeyword":"微波单片集成电路"}],"language":"zh","publisherId":"gnclyqjxb200003018","title":"GaAsHBT直接耦合微波单片集成电路","volume":"6","year":"2000"},{"abstractinfo":"成功地设计并制造出 GaAs MESFET霍尔开关集成电路.该电路采用了方形霍尔元件,绝对 灵敏度为 704mV/T;信号处理电路由差分放大电路和触发电路组成,触发电路结构类似于 SCFL 的 D触发器.结果表明,开关性能良好,工作点合理,达到设计要求.实验结果还表明,霍尔元件 和放大电路可构成灵敏度很高的霍尔线性集成电路. ","authors":[{"authorName":"胡少坚","id":"e147fe02-65ae-4fb1-86c6-4d62f0a8f985","originalAuthorName":"胡少坚"},{"authorName":"夏冠群","id":"a1638e1e-ec34-4af3-bcc1-9c9fb903b90e","originalAuthorName":"夏冠群"},{"authorName":"冯明","id":"04623381-4af0-4827-bc12-8f0d9d579e98","originalAuthorName":"冯明"},{"authorName":"詹琰","id":"b425ebf8-6ad4-4731-8a49-0da388007707","originalAuthorName":"詹琰"},{"authorName":"陈新宇","id":"60206775-8c36-45bc-b16b-6963b7fd5815","originalAuthorName":"陈新宇"},{"authorName":"蒋幼泉","id":"e37f61c3-4427-4b55-ade0-02956bbe2e4c","originalAuthorName":"蒋幼泉"},{"authorName":"李拂晓","id":"595106dc-88b7-43fc-b8a3-68e4af1b0b40","originalAuthorName":"李拂晓"}],"doi":"10.3969/j.issn.1007-4252.2003.01.010","fpage":"43","id":"da300974-270a-46d2-87e8-22d19bd6e03b","issue":"1","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报 "},"keywords":[{"id":"8a13d1f0-3ab8-4d07-9bd7-7edc19e3994b","keyword":"霍尔效应","originalKeyword":"霍尔效应"},{"id":"a1657a21-10db-44cf-a011-51230e081217","keyword":"磁传感器","originalKeyword":"磁传感器"},{"id":"adc8bff8-6025-413a-a6d6-3ec0e17f9108","keyword":"开关","originalKeyword":"开关"},{"id":"24f451a9-4e6b-4094-9fa3-ef6f28954e01","keyword":"GaAs","originalKeyword":"GaAs"},{"id":"1c48031a-73f6-4455-8854-5f9f3ca6d889","keyword":"集成电路","originalKeyword":"集成电路"}],"language":"zh","publisherId":"gnclyqjxb200301010","title":"GaAs霍尔开关集成电路的研制","volume":"9","year":"2003"}],"totalpage":322,"totalrecord":3217}