根据铜本身具有的性质,选用γ-氨丙基甲基二乙氧基硅烷(KH-902)对铜粉进行改性,并采用FT-IR、超景深显微镜、TG、SEM及EDS技术对改性铜粉及铜粉导电胶进行表征.结果表明,添加硅烷偶联剂KH-902可以有效改善铜粉的易氧化的问题,当添加量为3％时,不仅可以明显改善铜粉导电胶在高温固化下抗氧化性能,而且铜粉在环氧树脂胶体体系中能够均匀分散,且铜粉与铜粉之间的搭接紧密,具有良好的导电性能,体积电阻率仅1.31 × 10-2Ω·cm.
参考文献
| [1] | FU Zhenxiao,ZHANG Qitu,LING Zhida.Research and Application of New Conductive Adhesive[J].Jiangsu Ceram,2001,34(2):16-17 (in Chinese).傅振晓,张其土,凌志达.新型导电胶的研究与应用[J].江苏陶瓷,2001,34(2):16-17. |
| [2] | Tan F T,Qiao X L,Chen J G,et al.Effects of Coupling Agents on the Properties of Epoxy-based Electrically Conductive Adhesives[J].Int J Adhes Adhes,2006,26(6):406-413. |
| [3] | Myung Jin Yim,Yi Li,Kyoung Sik Moon,et al.Oxidation Prevention and Electrical Property Enhancement of Copper-filled Isotropically Conductive Adhesives[J].J Electron Mater,2007,36(10):1341-1347. |
| [4] | YU Fengbin,GUO Han,CAO Jianguo.Preparation and Characterization of Silver-Coated Copper Powder for Conductive Adhesives[J].Electroplat Pollut Control,2011,31(6):26-28(in Chinese).余凤斌,郭涵,曹建国.导电填料用镀银铜粉的制备及性能表征[J].电镀与环保,2011,31 (6):26-28. |
| [5] | HE Yiyan,FAN Xiutao,LU Ruiqing,et al.Anti-oxidation Silane Coupling Agent Enwrapped in the Surface of Copper Powder[J].Corros Prot,2006,27 (2):69-71 (in Chinese).何益艳,范修涛,陆瑞卿,等.铜粉表面包覆硅烷偶联剂改性研究[J].腐蚀与防护,2006,27(2):69-71. |
| [6] | Ooij W J,FU Desheng,FU Yuan.Application of Silane Coupling Agent on the Metal[J].SurfTechnol,1999,28(4):37-40 (in Chinese).威姆,傅德生,傅原.硅烷偶联剂在金属上的应用[J].表面技术,1999,28(4):37-40. |
| [7] | Su B,Qu J M.Effect of Filler Geometry on the Conduction of Isotropically Conductive Adhesives[C].ASME Conference Proceedings,2005:1889-1901. |
| [8] | WANG Kunhua,LUO Huaqiu,ZHOU Xiao.The Polymer Modem Instrumental Analysis[M].2nd Edition.Beijing:Tsinghua University Press,2000:5 (in Chinese).汪昆华,罗华秋,周啸.聚合物近代仪器分析[M].第2版.北京:清华大学出版社,2000:5. |
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