采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(P Ⅰ)的熔体粘度及溶解性的影响.结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能.在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ.随处理温度的增加,PⅡ低聚物的T5％随之增加,PⅡ在110℃处理的T5％为208℃,150℃处理的T5％为323℃,180℃处理的T5％为382℃,PⅡ固化后的T5％为550℃,显示出较优异的耐热性能.
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