通过溶胶-凝胶法制得平均粒径为226 nm形状规整的球形二氧化硅微球.用硅烷偶联剂KH-570作表面处理后,使用十二烷基硫酸钠作为乳化剂,采用超声化学的方法,将纳米级二氧化硅组装包覆在三聚氰胺甲醛树脂表面,形成具有高比表面积的微米级颗粒.通过红外光谱FT-IR、扫描电子显微镜、激光粒度测试等方法对二氧化硅及组装颗粒进行表征,并对合成机理进行分析.发现二氧化硅在三聚氰胺甲醛树脂颗粒上均匀包覆,最后包覆物粒径分布较均一,平均粒径为30 μm.
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