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采用干压成型法制备了多孔α-Al2O3基陶瓷片,研究了烧结温度和掺杂SiO2对其结构、形貌和性能的影响.提高烧结温度能增加α-Al2O3基陶瓷片的抗压强度,但收缩率也会随之增大.最佳烧结温度为1180℃,收缩率小于0.5%,抗压强度大于80 MPa.当掺杂SiO2粉体后,陶瓷片中的无定形SiO2在烧结过程中晶化形成方石英,能够促进α-A12O3陶瓷片的烧结.当SiO2含量为12wt%,并在1180℃下烧结时,陶瓷片的收缩率仅为1.2%,抗压强度大于110 MPa.与α-Al2O3陶瓷片相比,其孔径更小但孔径分布更宽.研究表明,α-Al2O3和SiO2/Al2O3陶瓷片均具有良好的分子筛膜生长活性.但由于载体具有不同的物化性质,所制备的ZSM-5分子筛膜具有不同的形貌和尺寸.

参考文献

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