用草酸盐共沉淀法制备了Y0 25Bi0.75O1.5(YSB),用X-ray衍射方法考察了其成相温度,用交流阻抗法测试了其电导率.与Ag复合制成复合阴极,研究了烧结温度对复合阴极微结构的影响.同时以Sm0.2Ce0.8O1.9(SDC)为电解质,用交流阻抗法研究YSB含量对复合阴极界面阻抗的影响.用草酸盐共沉淀制备的YSB粉,其电导率比SDC大得多.Ag-YSB复合阴极疏松多孔,Ag-YSB与SDC的界面结合良好,形成了足够多的三相界面,降低了界面极化电阻.YSB有一个最佳添加量,电阻最小,即电极界面性能最高.YSB的过量添加损坏Ag相的连续性,降低氧的还原转化速度,使界面的电阻增大.
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