用热压方法在850~1000℃制备出低温烧结AlN/硼硅酸盐玻璃复合材料.研究了玻璃的高温行为及其对AlN的润湿能力,分析了颗粒配比对复合材料烧结致密化的影响,探讨了影响复合材料热导率的因素.结果表明:引入对AlN润湿良好的硼硅酸盐玻璃,可将烧结温度降低到1000℃以下;采用适当的AlN和玻璃粉体的粒径比有利于提高复合材料的烧结致密化程度.具有均匀显微结构的低温烧结AlN/玻璃复合材料具有良好的导热性能,其热导率高于10 W/(m@K).
参考文献
[1] | Aziz Shaikh, Simon Turvey, Low Temperature cofired Ceramic (LTCC) Systems for Electronic Packages, in the Second International Symposium on Electronic Packaging Technology (Shanghai, The Commercial Press Shanghai Plant, 1996) p.199 |
[2] | Dong Zhaowen(董兆文),LTCC substrate Fabrication Process(LTCC基板制造工艺),Electronic Components &Materials(电子元件与材料),17(1),24(1998) |
[3] | Rao R.Tummala, Ceramic and Glass-Ceramic Packaging in the 1990s, J.Am. Ceram. Soc, 74(5), 895(1991) |
[4] | R.W.RICE, J.H.Enloe, J.W.Lau, Hot-Pressing-A New Route to High-Performance Ceramic Multilayer Electronrc Packaging, Am. Ceram. Soc. Bull., 71(5), 751(1992) |
[5] | P. Yang, M.A.Rodriguez, P. Kotula, Processing, Microstructure and electric properties of buried resistors in Low-Temperature Cofired Ceramics, J.Appl. Phys., 89(7), 4175(2001) |
[6] | Dernovsek, A.Naeini, G.Preu, W.Wersing, LTCC glass-ceramic composites for microwave application,J.Euro. Ceram. Soc., 21(10-11), 1693(2001) |
[7] | Huang Anbing(黄岸兵),Cui Song(崔嵩),Aluminum Nitride Ceramic Materials(氮化铝陶瓷材料),Microelectronic Technology(微电子技术),27(2),22(1999) |
[8] | Wang Daifeng(王岱峰),"Wenlan(李文兰),Zhuang Hanrui(庄汉锐),Guojingkun(郭景坤),Recent Progress in High Thermal Conductivity AlN Ceramics(高热导AlN陶瓷研究进展),Cailiao Daobao(材料导报),12(1),29(1998) |
[9] | L.M Sheppard, Aluminum Nitride: A Versatile but Challenging Material, Am. Ceram. Soc. Bulletin, 69(11),1801(1990) |
[10] | Yunsheng Xu, D.D.L.Chung, Cathleen Mroz, Thermally conducting aluminum nitride polymer-matrix composites, Composites: Part A, 32, 1749(2001) |
[11] | Troczynski T.B, Nicholson P.S, Effect of Additives on the Pressureless Sintering of Aluminum Nitride Between 1500 ℃ and 1800 ℃, J.Am. Ceram. Soc., 72(8), 1488(1989) |
[12] | H.Jantunen, R.Rautioaho, A.Uusimaki, S.Leppavuori, Compositions of MgTiO3-CaTiO3 Ceramic with 2Borosilicate Glasses for LTCC Technology, J.Europ. Ceram. Soc., 20(14-15), 2331(2000) |
[13] | J.H.Jean, T.K.Gupta, Densification Kinetics of binary borosilicate glass composite. J.Mater. Res., 9(2),486(1994) |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%