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利用选区激光烧结制备了亚微米WC-10%Co颗粒增强Cu基复合材料.利用X射线衍射仪、扫描电镜及原子力显微镜表征了激光烧结试样的显微组织.结果显示: WC增强颗粒或部分熔化且圆滑化,或完全熔化且原位析出;与基体具有连续相容的冶金结合界面.研究了工艺参数(激光功率、扫描速率、铺粉厚度)对烧结试样组织及性能的影响.结果表明,增加激光功率能改善增强颗粒与基体的界面结合性能.激光扫描速率大于0.05 m/s时,能提高增强颗粒分散均匀性.铺粉厚度降至0.30 mm以下,有利于提高烧结成形致密度.

参考文献

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