提出了用CuCl2溶液浸渍还原法制备C/SiC-Cu复合材料的新工艺.对还原工艺进行了初步探讨;用XRD、EDS、SEM研究复合材料的微观形貌及组成;用三点弯曲测定C/SiC-Cu复合材料的弯曲强度.结果表明:影响增重率的主要因素为C/SiC原料的气孔率和浸渍还原次数.Cu在复合材料中呈颗粒状或块状,它不仅渗入到纤维束间,还渗入到纤维间的微孔中.Cu的渗入对C/SiC复合材料的三点弯曲强度基本无影响.
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