研究了厚截面树脂基复合材料制造过程中的内部温度场发展变化.从含有非线性内热源的瞬态热传导方程出发,建立了用于分析复合材料热传导的有限元公式.以通用有限元软件包为基础,开发了能够模拟复合材料整个制造过程中复杂物理化学变化的软件.并用该软件对两种不同厚度树脂基复合材料的制造过程进行了模拟计算,发现现有的固化一般厚度复合材料的固化历程不适合固化厚截面复合材料.
参考文献
[1] | Oh J H, Lee D G. Cure cycle for thick glass/epoxy composite laminates[J]. Journal of Composite Materials, 2002, 36(1):19-45. |
[2] | Bogetti T A, Gillespie Jr J W. Two-dimensional cure simulation of thick thermosetting composite[J]. Journal of Composite Materials, 1991, 25:239-273. |
[3] | Kim J S, Lee D G. Development of an autoclave cure cycle with cooling and reheating steps for thick thermoset composite laminates[J]. Journal of Composite Materials, 1997, 31(22):2264-2282. |
[4] | Yang Z L, Lee S. Optimized curing of thick section composite laminates[J]. Materials and Manufacturing Processes, 2001, 16(4):541-560. |
[5] | Hojjati M, Hoa S V. Curing simulation of thick thermosetting composites[J]. Composites Manufacturing, 1994, 5(3):159-169. |
[6] | Park H C, Lee S W. Cure simulation of thick composite structures using the finite element method[J]. Journal of Composite Materials, 2001, 35(3):188-120. |
[7] | Twardowski T E, Lin S E, Geil P H. Curing in thick composite laminates: Experiment and simulation[J]. Journal of Composite Materials, 1993, 27:216-226. |
[8] | Costa V A F, Sousa A C M. Modeling of flow and thermo-kinetics during the cure of thick laminated composites[J]. International Journal of Thermal Sciences, 2003, 42:15-22. |
[9] | Antonucci V, Giordano M, Hsiao K-T,et al. A methodology to reduce thermal gradients due to the exothermic reactions in composites processing[J]. International Journal of Heat and Mass Transfer,2002,45:1675-1684. |
[10] | Li M, Zhu Q, Geubelle P H,et al. Optimal curing for thermoset matrix composites: Thermochemical consideration[J]. Polymer Composites, 2001, 22(1):118-131. |
[11] | 杨正林,陈浩然. 层合板在固化全过程中瞬态温度场及固化度的有限元分析[J]. 玻璃钢/复合材料,1997(3):3-7. |
[12] | Teplinsky S, Gutman E M. Computer simulation of process induced stress and strain development during cure of thick section thermosetting composites[J]. Computational Materials Science, 1996, 6:71-76. |
[13] | Chen H, Yang Z, Jemah A K,et al. Process-induced stress analysis of composite laminates using semi-analytical hamiltonian method[J]. Composite Structures, 1998, 41:49-55. |
[14] | Zhu Q,Geubelle P H. Dimensional accuracy of thermoset composites: Shape optimization[J]. Journal of Composite Materials, 2002, 36(1):647-672. |
[15] | Young W B. Compacting pressure and cure cycle for processing of thick composite laminates[J]. Composites Science and Technology, 1995, 54:299-306. |
[16] | Vancheeswaran R, Wadley N G. Model-based optimization of consolidation processing [J]. Materials Science and Engineering, 1998, A244:58-66. |
[17] | Li M,Tucker Ⅲ C. L. Modeling and simulation of two-dimensional consolidation for thermoset matrix composites[J]. Composites: Part A, 2002, 33:877-892. |
[18] | Guo Zhansheng ,Du Shanyi, Zhang Boming,et al. Cure reaction for a modified bismaleimide by isothermal DSC analysis[A]. 35th SAMPE International Technical Conference[C].USA:Dayton, 2003.859-864. |
[19] | Springer G S,Tsai S W. Thermal conductivities of unidirectional materials[J]. Journal of Composite Materials, 1967, 1:166-173. |
[20] | 中国航空材料手册编辑委员会编.中国航空材料手册(第2版).第6卷.复合材料胶粘剂[M].北京:中国标准出版社,2002.168-170. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%