铜与Al 2O3陶瓷的粘接

复合材料学报, 2001, 18(4): 133-135. doi: 10.3321/j.issn:1000-3851.2001.04.028

铜与Al 2O3陶瓷的粘接

邵光杰 ^1, , 秦秀娟 ^2, , 景勤 ^3, , 陈世镇 ^4,

1.燕山大学材料化工学院,秦皇岛,066004

2.燕山大学材料化工学院,秦皇岛,066004

3.燕山大学材料化工学院,秦皇岛,066004

4.燕山大学材料化工学院,秦皇岛,066004

基金项目: 河北省自然科学基金(599237)

关键词：铜 , 陶瓷 , 粘接

JOINING OF ALUMINA CERAMICS TO COPPER

用自制的装置研究了高温下铜与Al2O3陶瓷的直接粘接,重点考察了温度和压力对界面粘接强度的影响.在温度725 ℃,压力7.5 MPa,粘接时间300s的条件下,获得最大粘接强度为15.1 MPa.

参考文献

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