在脉冲电沉积过程中,采用超声波搅拌制备了厚度约为90 μm的金属镍镀层.XRD和TEM对不同超声波强度下制备的镀层的分析表明,镍镀层的晶粒尺寸随着超声波强度的变化而变化.在固定脉冲电解参数导通时间(ton)和关断时间(toff)分别为0.2和0.8 ms、平均电流密度为10 A/dm2、镀液pH值为4.0、温度为50 ℃的条件下,当施加的超声波强度由0 W增至50 W时,镀层平均晶粒尺寸从45 nm减至24 nm;但当超声波强度增至70 W时,镀层的平均晶粒尺寸增至38 nm.显微硬度测试结果表明,平均粒径为24 nm的镍镀层的HV高达760.
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