等温时效对SnAg/Cu表面贴装焊点微结构及剪切强度的影响

1.中国科学院上海冶金研究所-戴姆勒克莱斯勒联合电子封装研究实验室,上海,200050

2.中国科学院上海冶金研究所-戴姆勒克莱斯勒联合电子封装研究实验室,上海,200050

3.中国科学院上海冶金研究所-戴姆勒克莱斯勒联合电子封装研究实验室,上海,200050

EFFECT OF AGING ON THE MICROSTRUCTURE AND SHEAR STRENGTH OF EUTECTIC SnAg/Cu SURFACE MOUNT SOLDER JOINT

研究了等温时效对SnAg/Cu表面贴装焊点微结构,Sn-Cu金属间化合物生长及其剪切强度的影响,并与常用的62Sn36Pb2Ag/Cu焊点进行了比较.结果表明,在时效过程中,SnAg钎料以较小的反应速率与Cu发生反应.SnAg焊点显示了较强的剪切强度并且其受时效的影响较SnPbAg焊点要小.

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