采用润湿平衡法研究Yb对Sn-Cu-Ni无铅钎料在铜基板表面的润湿性能,探讨QFP32器件Sn-Cu-Ni-Yb焊点的力学性能和断口形貌.结果表明,微量的Yb可以显著减小Sn-Cu-Ni钎料润湿角,提高QFP器件焊点的力学性能,但是过量Yb的添加,会导致钎料和焊点性能的恶化,主要归因于大块稀土相(脆性相)的生成和稀土的氧化严重.对Sn-Cu-Ni-xYb钎料成分优化设计,发现Yb的最佳添加量为0.05％～0.06％.
Wettability balance method was used to study the effect of Yb on the wetting property of Sn-Cu-Ni on Cu substrate,and in QFP devices,the mechanical properties and the fracture morphology of Sn-Cu-Ni-Yb solder joints were analyzed,respectively.The results show that a small amount of rare earth Yb can reduce the wetting angle of solders and enhance the mechanical property of solder joints.However,excessive Yb addition can deteriorate of properties,which may attribute to the bulk Sn-Yb phases and the oxidation of rare earth.With the design of Sn-Cu-Ni-Yb composition,the optimization content of Yb is 0.05％ ～0.06％.
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