采用背散射电子衍射(EBSD和透射电镜(TEM)研究了纯铜大变形异步累积叠轧与再结晶过程中的低重合位置点阵(ΣCSL)晶界演化过程.研究表明:纯铜在600℃长时间均匀化退火时,形成大量较长的平直共格Σ3晶界,并作为大角度晶界阻碍晶粒的异常长大;在随后的大变形异步累积叠轧中,随着晶粒转动,形变组织的形成,低ΣCSL晶界的逐渐减少;再结晶退火中形成大量超细孪晶,同时形成大量Σ3特殊晶界,并与高ΣCSL晶界反应,形成大量低ΣCSL晶界,Σ1小角度晶界迅速增多,阻断一般大角度晶界网络,表明Σ3晶界的反应是大变形+退火纯铜晶界特征分布(GBCD)的优化机制.
The evolution of low-Σ CSL boundaries of ultra-fine twin copper in the process of asymmetrical accumulative rolling bonding (AARB) and recrystallization was studied by means of electron back-scattering diffraction (EBSD) technique and transmission electron microscopy (TEM).The results show that a large number of coherent Σ3 boundaries are obtained during homogenizing annealing at 600 ℃ for a long time,which it as large angle twin boundaries can put off the anomaly grain growth.In the subsequent lager strain deformation AARB,the fraction of low-Σ CSL boundaries gradually decreases due to the grain rotation and the formation of deformation structure.During recrystallization annealing,a large number of ultra-fined twins are obtained,and the fraction of Σ3 and Σ9 boundaries increases.The reaction of Σ3 boundaries with high-ΣCSL boundaries produces a large number of low-ΣCSL boundaries.The fast growing of Σ1 low-angle boundaries can block the net of high-angle boundaries.The interaction of Σ3 boundaries are the mechanism of grain boundary characteristics distribution(GBCD) optimization of the copper prepared by severe deformation and annealing.
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