在不同保温时间下,分别采用 Sn-3.0Ag-0.5Cu 和 Sn-3.0Ag-0.5Cu-3.0Bi 无铅软钎料,对表面镀镍的两种不同体积分数的 SiCP/6063Al 复合材料进行真空软钎焊。通过剪切强度测试、显微组织分析、能谱分析等手段研究了钎焊接头的组织和性能。结果表明：Bi 元素的加入改善了 Sn-3.0Ag-0.5Cu 钎料的铺展润湿性,降低了熔点,提高了焊缝的抗剪强度；在270℃保温35 min 时,Sn-3.0Ag-0.5Cu-3.0Bi 钎料钎焊接头抗剪强度达到最高值38.23 MPa；钎焊过程中只是两侧镀镍层间的焊接,钎料并未透过镍层与母材发生扩散反应。
SiCP/Al composites containing high and low volume fraction SiC after electroless nickel plating on the surface were soldered by using Sn-3.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu-3.0Bi solders in vacuum under different holding time.The microstructure and mechanical performance of soldered joints were studied by shearing strength test,SEM and EDS analysis.The results show that the Sn-3.0Ag-0.5Cu-3.0Bi solder has better spreading wettabili-ty,lower melting temperature and the shear strength of the seam is increased with the addition of Bi element.The shear strength of the soldered joint by using Sn-3.0Ag-0.5Cu-3.0Bi alloy reaches to the maximum of 38.23 MPa un-der soldering temperature of 270 ℃ and holding time for 35 min.Soldering process only occurs between the nickel-plating layer on both sides and the diffusion reaction does not occur through the solder to the base metal.
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