Mo-Cu合金具有优良的导热、导电性能,与陶瓷基片良好匹配的热膨胀系数,被广泛用作热沉材料和电子封装材料.采用粉末冶金法制备了Mo-Cu合金材料,研究了烧结工艺对Mo-25Cu合金组织和性能的影响.结果表明,Mo-25Cu合金最佳烧结工艺为烧结温度1200℃和保温时间2h.合金的抗弯强度和硬度分别为554MPa和56HRA,电阻率为3.7×10-8 Q ·m,热导率为138W·m-1 ·K-1.
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