利用金相显微镜、多功能摩擦磨损试验机(UMT)以及显微硬度仪研究了金属表面机械扭压处理方法(SMPT)对T2纯铜表面的显微组织及力学性能的影响.结果表明,经过SMPT处理后,T2纯铜表面晶粒尺寸由退火态的100μm细化到10μm左右;T2纯铜表面摩擦系数降低,耐磨性提高;T2纯铜的显微硬度由退火态的92HV提高到220HV.SMPT工艺可以使材料表层晶粒尺寸细化,并提高材料表层力学性能,可以作为制备细晶材料的一种方法.
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