研究了加H2对SiH4/N2/Ar高密度、低离子能量的等离子体淀积的氮化硅薄膜(淀积的衬底温度为400℃)电学和光学性能的影响.实验结果表明,加入H1使氮化硅薄膜的光学带隙增加,其折射率以及在氢氟酸缓冲液中腐蚀速率减小,而XPS测试的N、Si原子比没有改变,均为1.3.FTIR测量表明,样品中Si-H键的密度低于仪器检测限,而添加H2的样品中N-H键密度稍增加.此外,由淀积的氮化硅膜构成的MIS结构的高频C-V测试(1 MHz)显示,当氢气流量从零增加到8 sccm时,高频C-V的回滞幅度从(0.40土0.05)V降低到(0.10士0.01)V.基于这些实验结果和理论分析,表明了加适量H2能够促进弱的Si-Si键以及Si和N的悬挂键向Si-N键转化.
参考文献
[1] | Zhu, W.;Neumayer, D.;Perebeinos, V.;Avouris, P. .Silicon nitride gate dielectrics and band gap engineering in graphene layers[J].Nano letters,2010(9):3572-3576. |
[2] | ZhongCJ;TanakaH;SugawaS et al.High quality silicon nitride deposited by Ar/N2/H2/SiH4 high-density and low energy plasma at low temperature[J].Microelectronics Journal,2006,37:44. |
[3] | De Brito Mota F;Justo J F;Fazzio A .Hydrogen role on the properties of amorphous silicon nitride[J].Journal of Applied Physics,1999,86:1843. |
[4] | Lin S Y .Hydrogen-induced electronic states and vibrational modes in hydrogenated amorphous silicon nitride[J].THIN SOLID FILMS,2001,395:101. |
[5] | Shindo W;Sakai S;Tanaka H et al.Low-temperature large-grain poly-Si direct deposition by microwave plasma enhanced chemical vapor deposition using SiH4/Xe[J].J Vac Sci Techn A,1999,17:3134. |
[6] | Kern W;Puotinen A .Cleaning solution based on hydrogen peroxide for use in silicon semiconductor technology[J].RCA REVIEW,1970,31:187. |
[7] | Rocheleau R E;Zhan D Z .Densification of plasma deposited silicon nitride films by hydrogen dilution[J].THIN SOLID FILMS,1992,220:73. |
[8] | Cai L.;Yang D.;Elsayed MA.;Rohatgi A. .EFFECTS OF RAPID THERMAL ANNEAL ON REFRACTIVE INDEX AND HYDROGEN CONTENT OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITED SILICON NITRIDE FILMS[J].Journal of Applied Physics,1996(9):5384-5388. |
[9] | Smith D L;Alimonda A S;Chen C C et al.Mechanism of SiNxHy deposition from NH3-SiH4 plasma[J].Journal of the Electrochemical Society,1990,137:614. |
[10] | Claassen W A P;Valkenburg W G J N;Habraken F H P M et al.Characterization of plasma silicon nitride layers[J].J Electmchem Soc,1983,130:2419. |
[11] | Yin Z;Smith F W .Optical dielectric function and infrared absorption of hydrogenated amorphous silicon nitride films:Experimental results and effective-medium-approximation analysis[J].Physical Review B:Condensed Matter,1990,42:3666. |
[12] | Jellison GE.;Puretzky AA.;Geohegan DB.;Eres G.;Lowndes DH.;Caughman JB.;Merkulov VI. .Characterization of thin-film amorphous semiconductors using spectroscopic ellipsometry[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2000(0):68-73. |
[13] | Petalas J;Logothetidis S .Tetrahedron-model analysis of silicon nitride thin films and the effect of hydrogen and temperature on their optical properties[J].Physical Review B:Condensed Matter,1994,50:11802. |
[14] | Karcher R;Ley L;Johnson R L .Electronic structure of hydrogenated and unhydrogenated amorphous SiNx (0 ≤ x ≤1.6):A photoemission study[J].Physical Review B:Condensed Matter,1984,30:1896. |
[15] | Yin Z;Smith F W .Tetrahedron model for the optical dielectric function of hydrogenated amorphous silicon nitride alloys[J].Physical Review B:Condensed Matter,1990,42:3658. |
[16] | Martin-Moreno L;Martinez E;Verges J A et al.Electronic structure,defect states,and optical absorption of amorphous Si1-xNx[0≤x/(1-x)≤2][J].Physical Review B:Condensed Matter,1987,35:9683. |
[17] | Sharma V;Tracy C;Schroder D .Manipulation of K center charge states in silicon nitride films to achieve excellent surface passiveation for silicon solar cells[J].Applied Physics Letters,2014,104:053503. |
[18] | Macke H;Ludemann R .Detailed study of the composition of hydrogenated SiNx layers for high-quality silicon surface passivation[J].Journal of Applied Physics,2002,92:2602. |
[19] | Garcia S.;Diaz GG.;Castan E.;Duenas S.;Fernandez M.;Martil I. .Deposition of SiNx : H thin films by the electron cyclotron resonance and its application to Al/SiNx : H/Si structures[J].Journal of Applied Physics,1998(1):332-338. |
[20] | Misawa M;Fukunaka T;Niihara K et al.Structure characterization of CVD amorphous Si3N4 by pulsed neutron total scattering[J].JOURNAL OF NON-CRYSTALLINE SOLIDS,1979,34:313. |
[21] | Pacchioni G;Erbetta D .Charge transfer and charge conversion of K and N defect centers in Si3N4[J].Physical Review B:Condensed Matter,2000,61:15005. |
[22] | Robetson J .Electronic structure of silicon nitride[J].PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANIC,1991,63:47. |
[23] | Syutzmann M .The defect density in amorphous silicon[J].PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANIC,1989,60:531. |
[24] | Hasegawa S;Matsuda M;Kurata Y .Bonding configuration and defects in amorphous SiNx:H films[J].Applied Physics Letters,1991,58:741. |
[25] | Warren W L;Kanicki J;Robertson J et al.Electron paramagnetic resonance investigation of charge trapping centers in amorphous silicon nitride films[J].Journal of Applied Physics,1993,74:4034. |
[26] | Warren WL.;Robertson J.;Kanicki J.;Poindexter EH.;Seager CH. .CREATION AND PROPERTIES OF NITROGEN DANGLING BOND DEFECTS IN SILICON NITRIDE THIN FILMS[J].Journal of the Electrochemical Society,1996(11):3685-3691. |
[27] | Knotter D M;Denteneer T J J .Etching mechanism of silicon nitride in HF-based solutions[J].Journal of the Electrochemical Society,2001,148(03):F43. |
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