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采用双向脉冲电沉积法从Cr3+镀液中电沉积出铬镀层,并利用扫描电子显微镜(SEM)研究脉冲参数对铬镀层的微观形貌影响的规律,分析脉冲波形参数与Cr3+镀液阴极电流效率之间的相关性,就双向脉冲电沉积与直流电沉积过程中所得铬镀层的微观形貌、Cr3+镀液的阴极电流效率进行分析、比较.结果表明:平均电流密度、逆向脉冲系数、脉冲频率、以及占空比均对铬镀层的微观形貌及电流效率有较大影响;采用双向脉冲电沉积法制备出的铬镀层具有表面平整、结晶细致、粗糙度良好的特点,且具有较高的阴极电流效率.

参考文献

[1] 汪磊;李会峰;周煜;潘紫微;饶思贤.温度和湍流对 Cr 合金钢环烷酸腐蚀的影响[J].材料工程,2015(12):31-38.
[2] 侯峰岩;屠振密;屈云腾.环保型低浓度硫酸盐三价铬电沉积厚铬的研究[J].复旦学报:自然科学版,2012(2):168-172.
[3] 冯忠宝;詹振密;胡会利.环保型三价铬电沉积功能性铬层研究现状及发展[J].电镀与涂饰,2013(3):44-49.
[4] Aimin Liang;Liwei Ni;Qiao Liu;Junyan Zhang.Structure characterization and tribological properties of thick chromium coating electrodeposited from a Cr(III) electrolyte[J].Surface & Coatings Technology,2013:23-29.
[5] Elisabete S.C. Ferreira;C.M. Pereira;A.F. Silva.Electrochemical studies of metallic chromium electrodeposition from a Cr(III) bath[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2013:52-58.
[6] 孙化松;屠振密;李永彦;李炳江;李宁.常温高效硫酸盐三价铬电镀工艺[J].材料保护,2010(1):25-27,56.
[7] Y. B. Song;D. -T. Chin.Current efficiency and polarization behavior of trivalent chromium electrodeposition process[J].Electrochimica Acta,20024(4):349-356.
[8] 屠振密;郑剑;李宁;李永彦.三价铬电镀铬现状及发展趋势[J].表面技术,2007(5):59-63,87.
[9] 王华;曾振欧;赵国鹏;胡耀红.硫酸盐溶液体系中三价铬镀厚铬工艺及镀层性能研究[J].电镀与涂饰,2007(6):13-17.
[10] Protsenko, V.S.;Gordiienko, V.O.;Danilov, F.I..Unusual "chemical" mechanism of carbon co-deposition in Cr-C alloy electrodeposition process from trivalent chromium bath[J].Electrochemistry communications,2012:85-87.
[11] Phuong, N.V.;Kwon, S.C.;Lee, J.Y.;Lee, J.H.;Lee, K.H..The effects of pH and polyethylene glycol on the Cr(III) solution chemistry and electrodeposition of chromium[J].Surface & Coatings Technology,201221(21):4349-4355.
[12] Zeng, Z.;Zhang, Y.;Zhao, W.;Zhang, J..Role of complexing ligands in trivalent chromium electrodeposition[J].Surface & Coatings Technology,201120(20):4771-4775.
[13] V.S. Protsenko;F.I. Danilov;V.O. Gordiienko;S.C. Kwon;M. Kim;J.Y. Lee.Electrodeposition of hard nanocrystalline chrome from aqueous sulfate trivalent chromium bath[J].Thin Solid Films,20111(1):380-383.
[14] C.-A. Huang;W. Lin;M.J. Liao.The electrochemical behaviour of the bright chromium deposits plated with direct- and pulse-current in 1 M H_2SO_4[J].Corrosion Science: The Journal on Environmental Degradation of Materials and its Control,20062(2):460-471.
[15] Jing-Yin Fei;G. D. Wilcox.Electrodeposition of Zn-Co alloys with pulse containing reverse current[J].Electrochimica Acta,200513(13):2693-2698.
[16] 张午花;费敬银;骆立立;林西华.脉冲电沉积高速Ni工艺研究[J].中国腐蚀与防护学报,2013(4):317-324.
[17] 陈叶;费敬银;王磊;万冰华.脉冲电沉积法制备高P镍基合金镀层[J].中国腐蚀与防护学报,2012(06):501-506.
[18] FEI Jingyin;LIANG Guozheng;XIN Wenli.Composition and Morphology of Zn-Co Alloy Coatings Deposited by Means of Pulse Plating Containing Reverse Current[J].武汉理工大学学报(材料科学版)(英文版),2007(03):417-421.
[19] M. S. Chandrasekar;Malathy Pushpavanam.Pulse and pulse reverse plating - Conceptual, advantages and applications[J].Electrochimica Acta,20088(8):3313-3322.
[20] Hou KH;Hwu WH;Ke ST;Ger MD.Ni-P-SiC composite produced by pulse and direct current plating[J].Materials Chemistry and Physics,20061(1):54-59.
[21] S. Mohan;G. Saravanan;N. G. Renganathan.Comparison of chromium coatings and electrochemical behaviour with direct current and pulse current deposition in trivalent chromium formate urea bath as alternative to conventional Cr coatings[J].Surface Engineering,201110(10):775-783.
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